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X28HC64 64K
X28HC64
5 Volt, Byte Alterable E2PROM
* *
8K x 8 Bit
FEATURES
* *
* *
* *
55ns Access Time Simple Byte and Page Write --Single 5V Supply --No External High Voltages or VPP Control Circuits --Self-Timed --No Erase Before Write --No Complex Programming Algorithms --No Overerase Problem Low Power CMOS --40 mA Active Current Max. --200 A Standby Current Max. Fast Write Cycle Times --64 Byte Page Write Operation --Byte or Page Write Cycle: 2ms Typical --Complete Memory Rewrite: 0.25 sec. Typical --Effective Byte Write Cycle Time: 32s Typical Software Data Protection End of Write Detection --DATA Polling --Toggle Bit
High Reliability --Endurance: 100,000 Cycles --Data Retention: 100 Years JEDEC Approved Byte-Wide Pinout
DESCRIPTION
The X28HC64 is an 8K x 8 E2PROM, fabricated with Xicor's proprietary, high performance, floating gate CMOS technology. Like all Xicor programmable nonvolatile memories the X28HC64 is a 5V only device. The X28HC64 features the JEDEC approved pinout for bytewide memories, compatible with industry standard RAMs. The X28HC64 supports a 64-byte page write operation, effectively providing a 32s/byte write cycle and enabling the entire memory to be typically written in 0.25 seconds. The X28HC64 also features DATA Polling and Toggle Bit Polling, two methods providing early end of write detection. In addition, the X28HC64 includes a user-optional software data protection mode that further enhances Xicor's hardware write protect capability. Xicor E2PROMs are designed and tested for applications requiring extended endurance. Inherent data retention is greater than 100 years.
TSOP
A2 A1 A0 I/O0 I/O1 I/O2 NC VSS NC I/O3 I/O4 I/O5 I/O6 I/O7 CE A10 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 A3 A4 A5 A6 A7 A12 NC NC VCC NC WE NC A8 A9 A11 OE
PIN CONFIGURATIONS
VCC
A12
WE
NC
NC
NC
A7
PLASTIC DIP FLAT PACK CERDIP SOIC NC A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 X28HC64 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC WE NC A8 A9 A11 OE A10 CE I/O7 I/O6 I/O5 I/04 I/O3
A6 A5 A4 A3 A2 A1 A0 NC I/O0 5 6 7 8 9
LCC PLCC
X28HC64
4
3
2
1 32 31 30 29 28 27 26 A8 A9 A11 NC OE A10 CE I/O7 I/O6
X28HC64
25 24 23 22
PGA
I/O1 I/O2 I/O3 I/O5 I/O6 12 13 15 17 18 I/O0 A0 11 10 A1 A3 A5 A2 A4 A12 X28HC64 VSS I/O4 I/O7 14 16 19 CE 20 OE 22 A10 21 A11 23 A8 25 NC 26
3857 ILL F22
10 11 12
21 13 14 15 16 17 18 19 20
I/O1 I/O2 VSS NC I/O3 I/O4 I/O5
9
8
7
3857 FHD F03
6
5
3857 FHD F02.1
2
VCC A9 28 24 NC 1 WE 27
4
A6
3
A7
3857 FHD F04
BOTTOM VIEW
(c) Xicor, Inc. 1994, 1995, 1996 Patents Pending 3857-3.0 8/5/97 T1/C0/D0 EW
1
Characteristics subject to change without notice
X28HC64
PIN DESCRIPTIONS Addresses (A0-A12) The Address inputs select an 8-bit memory location during a read or write operation. Chip Enable (CE) The Chip Enable input must be LOW to enable all read/ write operations. When CE is HIGH, power consumption is reduced. Output Enable (OE) The Output Enable input controls the data output buffers and is used to initiate read operations. Data In/Data Out (I/O0-I/O7) Data is written to or read from the X28HC64 through the I/O pins. Write Enable (WE) The Write Enable input controls the writing of data to the X28HC64. FUNCTIONAL DIAGRAM
65,536-BIT E2PROM ARRAY
PIN NAMES Symbol A0-A12 I/O0-I/O7 WE CE OE VCC VSS NC Description Address Inputs Data Input/Output Write Enable Chip Enable Output Enable +5V Ground No Connect
3857 PGM T01
X BUFFERS LATCHES AND DECODER A0-A12 ADDRESS INPUTS Y BUFFERS LATCHES AND DECODER
I/O BUFFERS AND LATCHES
I/O0-I/O7 DATA INPUTS/OUTPUTS CE OE WE VCC VSS
3857 FHD F01
CONTROL LOGIC AND TIMING
2
X28HC64
DEVICE OPERATION Read Read operations are initiated by both OE and CE LOW. The read operation is terminated by either CE or OE returning HIGH. This two line control architecture eliminates bus contention in a system environment. The data bus will be in a high impedance state when either OE or CE is HIGH. Write Write operations are initiated when both CE and WE are LOW and OE is HIGH. The X28HC64 supports both a CE and WE controlled write cycle. That is, the address is latched by the falling edge of either CE or WE, whichever occurs last. Similarly, the data is latched internally by the rising edge of either CE or WE, whichever occurs first. A byte write operation, once initiated, will automatically continue to completion, typically within 2ms. Page Write Operation The page write feature of the X28HC64 allows the entire memory to be written in 0.25 seconds. Page write allows two to sixty-four bytes of data to be consecutively written to the X28HC64 prior to the commencement of the internal programming cycle. The host can fetch data from another device within the system during a page write operation (change the source address), but the page address (A6 through A12) for each subsequent valid write cycle to the part during this operation must be the same as the initial page address. The page write mode can be initiated during any write operation. Following the initial byte write cycle, the host can write an additional one to sixty-three bytes in the same manner as the first byte was written. Each successive byte load cycle, started by the WE HIGH to LOW transition, must begin within 100s of the falling edge of the preceding WE. If a subsequent WE HIGH to LOW transition is not detected within 100s, the internal automatic programming cycle will commence. There is no page write window limitation. Effectively the page write window is infinitely wide, so long as the host continues to access the device within the byte load cycle time of 100s. Write Operation Status Bits The X28HC64 provides the user two write operation status bits. These can be used to optimize a system write cycle time. The status bits are mapped onto the I/O bus as shown in Figure 1. Figure 1. Status Bit Assignment
I/O
DP
TB
5
4
3
2
1
0
RESERVED TOGGLE BIT DATA POLLING
3857 FHD F11
DATA Polling (I/O7) The X28HC64 features DATA Polling as a method to indicate to the host system that the byte write or page write cycle has completed. DATA Polling allows a simple bit test operation to determine the status of the X28HC64, eliminating additional interrupt inputs or external hardware. During the internal programming cycle, any attempt to read the last byte written will produce the complement of that data on I/O7 (i.e. write data = 0xxx xxxx, read data = 1xxx xxxx). Once the programming cycle is complete, I/O7 will reflect true data. Toggle Bit (I/O6) The X28HC64 also provides another method for determining when the internal write cycle is complete. During the internal programming cycle I/O6 will toggle from HIGH to LOW and LOW to HIGH on subsequent attempts to read the device. When the internal cycle is complete the toggling will cease and the device will be accessible for additional read or write operations.
3
X28HC64
DATA POLLING I/O7 Figure 2. DATA Polling Bus Sequence
LAST WRITE
WE
CE
OE VIH I/O7 HIGH Z VOL An An An An An An An
3857 FHD F12
VOH X28HC64 READY
A0-A12
Figure 3. DATA Polling Software Flow DATA Polling can effectively reduce the time for writing to the X28HC64. The timing diagram in Figure 2 illustrates the sequence of events on the bus. The software flow diagram in Figure 3 illustrates one method of implementing the routine.
WRITE DATA
WRITES COMPLETE? YES SAVE LAST DATA AND ADDRESS
NO
READ LAST ADDRESS
IO7 COMPARE? YES
NO
READY
3857 FHD F13
4
X28HC64
THE TOGGLE BIT I/O6 Figure 4. Toggle Bit Bus Sequence
LAST WRITE
WE
CE
OE
I/O6
VOH * VOL
HIGH Z
* X28HC64 READY
* Beginning and ending state of I/O6 will vary.
3857 FHD F14
Figure 5. Toggle Bit Software Flow The Toggle Bit can eliminate the software housekeeping chore of saving and fetching the last address and data written to a device in order to implement DATA Polling. This can be especially helpful in an array comprised of multiple X28HC64 memories that is frequently updated. Toggle Bit Polling can also provide a method for status checking in multiprocessor applications. The timing diagram in Figure 4 illustrates the sequence of events on the bus. The software flow diagram in Figure 5 illustrates a method for polling the Toggle Bit.
LAST WRITE
LOAD ACCUM FROM ADDR n
COMPARE ACCUM WITH ADDR n
COMPARE OK? YES
NO
READY
3857 FHD F15
5
X28HC64
HARDWARE DATA PROTECTION The X28HC64 provides two hardware features that protect nonvolatile data from inadvertent writes. * Default VCC Sense--All write functions are inhibited when VCC is 3V typically. * Write Inhibit--Holding either OE LOW, WE HIGH, or CE HIGH will prevent an inadvertent write cycle during power-up and power-down, maintaining data integrity. SOFTWARE DATA PROTECTION The X28HC64 offers a software controlled data protection feature. The X28HC64 is shipped from Xicor with the software data protection NOT ENABLED; that is, the device will be in the standard operating mode. In this mode data should be protected during power-up/-down operations through the use of external circuits. The host would then have open read and write access of the device once VCC was stable. The X28HC64 can be automatically protected during power-up and power-down without the need for external circuits by employing the software data protection feature. The internal software data protection circuit is enabled after the first write operation utilizing the software algorithm. This circuit is nonvolatile and will remain set for the life of the device unless the reset command is issued. Once the software protection is enabled, the X28HC64 is also protected from inadvertent and accidental writes in the powered-up state. That is, the software algorithm must be issued prior to writing additional data to the device. SOFTWARE ALGORITHM Selecting the software data protection mode requires the host system to precede data write operations by a series of three write operations to three specific addresses. Refer to Figure 6 and 7 for the sequence. The three-byte sequence opens the page write window enabling the host to write from one to sixty-four bytes of data. Once the page load cycle has been completed, the device will automatically be returned to the data protected state.
6
X28HC64
SOFTWARE DATA PROTECTION Figure 6. Timing Sequence--Byte or Page Write
VCC 0V DATA ADDR CE tBLC MAX WE BYTE OR PAGE
3857 FHD F16
(VCC) AA 1555 55 0AAA A0 1555 WRITES OK WRITE PROTECTED
tWC
Figure 7. Write Sequence for Software Data Protection Regardless of whether the device has previously been protected or not, once the software data protection algorithm is used, the X28HC64 will automatically disable further writes unless another command is issued to deactivate it. If no further commands are issued the X28HC64 will be write protected during power-down and after any subsequent power-up.
WRITE DATA AA TO ADDRESS 1555
WRITE DATA 55 TO ADDRESS 0AAA
Note:
Once initiated, the sequence of write operations should not be interrupted.
WRITE DATA A0 TO ADDRESS 1555 BYTE/PAGE LOAD ENABLED WRITE DATA XX TO ANY ADDRESS OPTIONAL BYTE OR PAGE WRITE ALLOWED
WRITE LAST BYTE TO LAST ADDRESS
AFTER tWC RE-ENTERS DATA PROTECTED STATE
3857 FHD F17
7
X28HC64
RESETTING SOFTWARE DATA PROTECTION Figure 8. Reset Software Data Protection Timing Sequence
Vcc STANDARD OPERATING MODE
DATA AA ADDR 1555 CE
55 0AAA
80 1555
AA 1555
55 0AAA
20 1555
tWC
WE
3857 ILL F18.2
Figure 9. Software Sequence to Deactivate Software Data Protection In the event the user wants to deactivate the software data protection feature for testing or reprogramming in an E2PROM programmer, the following six step algorithm will reset the internal protection circuit. After tWC, the X28HC64 will be in standard operating mode.
WRITE DATA AA TO ADDRESS 1555
Note:
WRITE DATA 55 TO ADDRESS 0AAA
Once initiated, the sequence of write operations should not be interrupted.
WRITE DATA 80 TO ADDRESS 1555
WRITE DATA AA TO ADDRESS 1555
WRITE DATA 55 TO ADDRESS 0AAA
WRITE DATA 20 TO ADDRESS 1555
3857 ILL F19.2
8
X28HC64
SYSTEM CONSIDERATIONS Because the X28HC64 is frequently used in large memory arrays, it is provided with a two line control architecture for both read and write operations. Proper usage can provide the lowest possible power dissipation and eliminate the possibility of contention where multiple I/O pins share the same bus. To gain the most benefit it is recommended that CE be decoded from the address bus and be used as the primary device selection input. Both OE and WE would then be common among all devices in the array. For a read operation, this assures that all deselected devices are in their standby mode and that only the selected device(s) is outputting data on the bus. Because the X28HC64 has two power modes, standby and active, proper decoupling of the memory array is of Normalized ICC(RD) by Temperature Over Frequency
1.4 5.5 VCC 1.2
ICC RD NORMALIZED (mA) ICC RD NORMALIZED (mA)
prime concern. Enabling CE will cause transient current spikes. The magnitude of these spikes is dependent on the output capacitive loading of the I/Os. Therefore, the larger the array sharing a common bus, the larger the transient spikes. The voltage peaks associated with the current transients can be suppressed by the proper selection and placement of decoupling capacitors. As a minimum, it is recommended that a 0.1F high frequency ceramic capacitor be used between VCC and VSS at each device. Depending on the size of the array, the value of the capacitor may have to be larger. In addition, it is recommended that a 4.7F electrolytic bulk capacitor be placed between VCC and VSS for each eight devices employed in the array. This bulk capacitor is employed to overcome the voltage droop caused by the inductive effects of the PC board traces.
Normalized ICC(RD) @ 25% Over the VCC Range and Frequency
1.4
- 55C + 25C + 125C
1.2 1.0
5.5 VCC 5.0 VCC 4.5 VCC
1.0 0.8 0.6 0.4 0.2 0 10
0.8 0.6 0.4 0.2
20
3857 FHD F20.1
0
10 FREQUENCY (MHz)
20
3857 FHD F21.1
FREQUENCY (MHz)
9
X28HC64
ABSOLUTE MAXIMUM RATINGS* Temperature under Bias X28HC64 ..................................... -10C to +85C X28HC64I, X28HC64M ............. -65C to +135C Storage Temperature ....................... -65C to +150C Voltage on any Pin with Respect to VSS ....................................... -1V to +7V D.C. Output Current ............................................. 5mA Lead Temperature (Soldering, 10 seconds) .............................. 300C RECOMMENDED OPERATING CONDITIONS Temperature Commercial Industrial Military Min. 0C -40C -55C Max. +70C +85C +125C
3857 PGM T02.1
*COMMENT Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage X28HC64
Limits 5V 10%
3857 PGM T03.1
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions unless otherwise specified.) Limits Symbol ICC Parameter VCC Current (Active) (TTL Inputs) VCC Current (Standby) (TTL Inputs) VCC Current (Standby) (CMOS Inputs) Input Leakage Current Output Leakage Current Input LOW Voltage Input HIGH Voltage Output LOW Voltage Output HIGH Voltage Min. Typ.(1) 15 Max. 40 Units mA Test Conditions CE = OE = VIL, WE = VIH, All I/O's = Open, Address Inputs = TTL Levels @ f = 10 MHz CE = VIH, OE = VIL All I/O's = Open, Other Inputs = VIH CE = VCC - 0.3V, OE = GND All I/O's = Open, Other Inputs = VCC - 0.3V VIN = VSS to VCC VOUT = VSS to VCC, CE = VIH
ISB1 ISB2
1 100
2 200
mA A A A V V V V
ILI ILO VlL(2) VIH(2) VOL VOH
-1 2 2.4
10 10 0.8 VCC + 1 0.4
IOL = 5mA IOH = -5mA
3857 PGM T04.2
Notes: (1) Typical values are for TA = 25C and nominal supply voltage (2) VIL min. and VIH max. are for reference only and are not tested.
10
X28HC64
ENDURANCE AND DATA RETENTION Parameter Minimum Endurance Data Retention POWER-UP TIMING Symbol tPUR(3) tPUW(3) Parameter Power-up to Read Operation Power-up to Write Operation Typ. (1) 100 5 Units s ms
3857 PGM T06
Min. 100,000 100
Max.
Unit Cycles Years
3857 PGM T05.3
CAPACITANCE TA = +25C, f = 1MHz, VCC = 5V Symbol CI/O(3) CIN(3) Parameter Input/Output Capacitance Input Capacitance MODE SELECTION CE L L H X X OE L H X L X WE H L X X H Mode Read Write Standby and Write Inhibit Write Inhibit Write Inhibit I/O DOUT DIN High Z -- -- Power Active Active Standby -- --
3857 PGM T09
Max. 10 6
Units pF pF
Test Conditions VI/O = 0V VIN = 0V
3857 PGM T07.1
A.C. CONDITIONS OF TEST Input Pulse Levels Input Rise and Fall Times Input and Output Timing Levels 0V to 3V 5ns 1.5V
3857 PGM T08.1
Note:
(3) This parameter is periodically sampled and not 100% tested.
EQUIVALENT A.C. LOAD CIRCUITS
5V
SYMBOL TABLE
WAVEFORM
INPUTS Must be steady May change from LOW to HIGH May change from HIGH to LOW
OUTPUTS Will be steady Will change from LOW to HIGH Will change from HIGH to LOW Changing: State Not Known Center Line is High Impedance
1.92K OUTPUT 1.37K 30pF
3857 FHD F22.3
Don't Care: Changes Allowed N/A
11
X28HC64
A.C. CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Read Cycle Limits X28HC64-70 Symbol tRC tCE tAA tOE tLZ(4) tOLZ(4) tHZ(4) tOHZ(4) tOH Parameter Read Cycle Time Chip Enable Access Time Address Access Time Output Enable Access Time CE LOW to Active Output OE LOW to Active Output CE HIGH to High Z Output OE HIGH to High Z Output Output Hold from Address Change Min. 70 70 70 35 0 0 30 30 0 0 0 0 30 30 0 Max. X28HC64-90 Min. 90 90 90 40 0 0 30 30 Max. X28HC64-12 Min. 120 120 120 50 Max. Units ns ns ns ns ns ns ns ns ns
-55C to +125C -55C to +125C -55C to +125C
3857 PGM T10.1
Read Cycle
tRC ADDRESS tCE CE tOE OE VIH WE tOLZ tLZ DATA I/O HIGH Z DATA VALID tAA
3857 FHD F05
tOHZ tOH tHZ DATA VALID
Notes: (4) tLZ min., tHZ, tOLZ min., and tOHZ are periodically sampled and not 100% tested. tHZ max. and tOHZ max. are measured from the point when CE or OE return HIGH (whichever occurs first) to the time when the outputs are no longer driven.
12
X28HC64
WRITE CYCLE LIMITS Symbol tWC(5) tAS tAH tCS tCH tCW tOES tOEH tWP tWPH(6) tDV(6) tDS tDH tDW(6) tBLC Parameter Write Cycle Time Address Setup Time Address Hold Time Write Setup Time Write Hold Time CE Pulse Width OE HIGH Setup Time OE HIGH Hold Time WE Pulse Width WE HIGH Recovery Data Valid Data Setup Data Hold Delay to Next Write Byte Load Cycle Min. 0 50 0 0 50 0 0 50 50 1 50 0 10 0.15 Typ.(1) 2 Max. 5 Units ms ns ns ns ns ns ns ns ns ns s ns ns s s
3857 PGM T11.2
100
WE Controlled Write Cycle
tWC ADDRESS tAS tCS CE tAH tCH
OE tOES WE tDV DATA IN DATA VALID tDS DATA OUT HIGH Z
3857 FHD F06
tWP
tOEH
tDH
Notes: (5) tWC is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum time the device requires to automatically complete the internal write operation. (6) tWPH and tDW are periodically sampled and not 100% tested.
13
X28HC64
CE Controlled Write Cycle
tWC ADDRESS tAS CE tOES OE tOEH tCS WE tDV DATA IN DATA VALID tDS DATA OUT HIGH Z
3857 FHD F07
tAH tCW
tCH
tDH
Page Write Cycle
(7)
OE
CE tWP WE tWPH ADDRESS *
(8)
tBLC
I/O BYTE 0 BYTE 1 BYTE 2 BYTE n BYTE n+1
LAST BYTE BYTE n+2 tWC
3857 FHD F08
*For each successive write within the page write operation, A6-A12 should be the same or writes to an unknown address could occur.
Notes: (7) Between successive byte writes within a page write operation, OE can be strobed LOW: e.g. this can be done with CE and WE HIGH to fetch data from another memory device within the system for the next write; or with WE HIGH and CE LOW effectively performing a polling operation. (8) The timings shown above are unique to page write operations. Individual byte load operations within the page write must conform to either the CE or WE controlled write cycle timing.
14
X28HC64
DATA Polling Timing Diagram(9)
ADDRESS An An An
CE
WE tOEH OE tDW I/O7 DIN=X DOUT=X tWC DOUT=X tOES
3857 FHD F09
Toggle Bit Timing Diagram(9)
CE
WE tOEH OE tDW I/O6 HIGH Z * tWC * I/O6 beginning and ending state will vary, depending upon actual tWC. * tOES
3857 FHD F10
Note:
(9) Polling operations are by definition read cycles and are therefore subject to read cycle timings.
15
X28HC64
PACKAGING INFORMATION
28-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P
1.460 (37.08) 1.400 (35.56)
0.550 (13.97) 0.510 (12.95) PIN 1 INDEX PIN 1 1.300 (33.02) REF. 0.085 (2.16) 0.040 (1.02)
SEATING PLANE 0.150 (3.81) 0.125 (3.17)
0.160 (4.06) 0.125 (3.17)
0.030 (0.76) 0.015 (0.38)
0.110 (2.79) 0.090 (2.29)
0.062 (1.57) 0.050 (1.27)
0.020 (0.51) 0.016 (0.41)
0.610 (15.49) 0.590 (14.99)
TYP. 0.010 (0.25)
0 15
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
3926 FHD F04
16
X28HC64
PACKAGING INFORMATION
28-LEAD HERMETIC DUAL IN-LINE PACKAGE TYPE D
1.490 (37.85) 1.435 (36.45)
0.610 (15.49) 0.500 (12.70)
PIN 1 1.30 (33.02) REF. 0.100 (2.54) 0.035 (0.89)
SEATING PLANE 0.200 (5.08) 0.125 (3.18)
0.225 (5.72) 0.140 (3.56)
0.060 (1.52) 0.015 (0.38)
0.110 (2.79) 0.090 (2.29) TYP. 0.100 (2.54)
0.070 (1.78) 0.030 (0.76) TYP. 0.055 (1.40)
0.026 (0.66) 0.014 (0.36) TYP. 0.018 (0.46)
0.620 (15.75) 0.590 (14.99) TYP. 0.614 (15.60)
TYP. 0.010 (0.25)
0 15
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
3926 FHD F08
17
X28HC64
PACKAGING INFORMATION
32-LEAD PLASTIC LEADED CHIP CARRIER PACKAGE TYPE J
0.420 (10.67)
0.050 (1.27) TYP.
0.045 (1.14) x 45
0.021 (0.53) 0.013 (0.33) TYP. 0.017 (0.43)
0.495 (12.57) 0.485 (12.32) TYP. 0.490 (12.45) 0.453 (11.51) 0.447 (11.35) TYP. 0.450 (11.43) 0.300 (7.62) REF. PIN 1
SEATING PLANE 0.004 LEAD CO - PLANARITY -- 0.015 (0.38) 0.095 (2.41) 0.060 (1.52) 0.140 (3.56) 0.100 (2.45) TYP. 0.136 (3.45) 0.048 (1.22) 0.042 (1.07)
0.595 (15.11) 0.585 (14.86) TYP. 0.590 (14.99) 0.553 (14.05) 0.547 (13.89) TYP. 0.550 (13.97) 0.400 (10.16)REF. 3 TYP.
NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. DIMENSIONS WITH NO TOLERANCE FOR REFERENCE ONLY
3926 FHD F13
18
X28HC64
PACKAGING INFORMATION
28-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
0.2980 (7.5692) 0.2920 (7.4168)
0.4160 (10.5664) 0.3980 (10.1092)
0.0192 (0.4877) 0.0138 (0.3505)
0.7080 (17.9832) 0.7020 (17.8308)
0.1040 (2.6416) 0.0940 (2.3876)
BASE PLANE SEATING PLANE 0.050 (1.270) BSC 0.0110 (0.2794) 0.0040 (0.1016)
0.0160 (0.4064) X 45 0.0100 (0.2540)
0 - 8
0.0125 (0.3175) 0.0090 (0.2311)
0.0350 (0.8890) 0.0160 (0.4064)
NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.004 INCHES 3. BACK EJECTOR PIN MARKED "KOREA" 4. CONTROLLING DIMENSION: INCHES (MM)
3926 FHD F17
19
X28HC64
PACKAGING INFORMATION
32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E
0.150 (3.81) BSC 0.020 (0.51) x 45 REF.
PIN 1
0.095 (2.41) 0.075 (1.91) 0.022 (0.56) 0.006 (0.15)
0.200 (5.08) BSC
0.055 (1.39) 0.045 (1.14) TYP. (4) PLCS.
0.028 (0.71) 0.022 (0.56) (32) PLCS.
0.050 (1.27) BSC
0.040 (1.02) x 45 REF. TYP. (3) PLCS.
0.458 (11.63) 0.442 (11.22) 0.458 (11.63) -- 0.300 (7.62) BSC 0.120 (3.05) 0.060 (1.52)
0.088 (2.24) 0.050 (1.27)
0.560 (14.22) 0.540 (13.71) 0.400 (10.16) BSC 0.558 (14.17) --
PIN 1 INDEX CORDER
NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: 1% NLT 0.005 (0.127)
3926 FHD F14
20
X28HC64
PACKAGING INFORMATION
28-LEAD CERAMIC PIN GRID ARRAY PACKAGE TYPE K
12
13
15
17
18
11
10
14
16
19 A 0.008
9
8
20
21
7
6
22
23 0.050 A
5
2
28
24
25
NOTE: LEADS 4,12,18 & 26
4
3
1
27
26
TYP. 0.100 ALL LEADS
0.080 0.070
PIN 1 INDEX
0.080 4 CORNERS 0.070 0.100 0.080 0.072 0.061
0.020 0.016
0.660 (16.76) 0.640 (16.26)
A
A 0.561 (14.25) 0.541 (13.75) 0.185 (4.70) 0.175 (4.44)
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
3926 FHD F15
21
X28HC64
PACKAGING INFORMATION
28-LEAD CERAMIC FLAT PACK
0.019 (0.48) 0.015 (0.38) 28
PIN 1 INDEX 1
0.050 (1.27) BSC 0.740 (18.80) MAX.
0.045 (1.14) MAX. 0.440 (11.18) MAX.
0.006 (0.15) 0.003 (0.08)
0.130 (3.30) 0.090 (2.29)
0.370 (9.40) 0.250 (6.35) TYP. 0.300 2 PLCS.
0.180 (4.57) MIN.
0.045 (1.14) 0.025 (0.66)
0.030 (0.76) MIN.
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
3926 FHD F16
22
X28HC64
PACKAGING INFORMATION
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) TYPE T
SEE NOTE 2 12.50 (0.492) 12.30 (0.484) PIN #1 IDENT. O 0.76 (0.03)
0.50 (0.0197) BSC SEE NOTE 2 8.02 (0.315) 7.98 (0.314) 0.26 (0.010) 0.14 (0.006)
1.18 (0.046) 1.02 (0.040) 0.17 (0.007) 0.03 (0.001) SEATING PLANE 0.58 (0.023) 0.42 (0.017) 14.15 (0.557) 13.83 (0.544)
14.80 0.05 (0.583 0.002) 0.30 0.05 (0.012 0.002) TYPICAL 32 PLACES 15 EQ. SPC. 0.50 0.04 0.0197 0.016 = 7.50 0.06 (0.295 0.0024) OVERALL TOL. NON-CUMULATIVE
SOLDER PADS
0.17 (0.007) 0.03 (0.001) FOOTPRINT
1.30 0.05 (0.051 0.002)
0.50 0.04 (0.0197 0.0016)
NOTE: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES IN PARENTHESES).
3926 ILL F38.1
23
X28HC64
ORDERING INFORMATION
X28HC64 Device
X
X
-X Access Time -55 = 55ns -70 = 70ns -90 = 90ns -12 = 120ns Temperature Range Blank = Commercial = 0C to +70C I = Industrial = -40C to +85C M = Military = -55C to +125C MB = MIL-STD-883 Package P = 28-Lead Plastic DIP D = 28-Lead Cerdip J = 32-Lead PLCC S = 28-Lead Plastic SOIC E = 32-Pad LCC K = 28-Lead Pin Grid Array F = 28-Lead Flat Pack T = 32-Lead TSOP
LIMITED WARRANTY Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness tor any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice. Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied. US. PATENTS Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976. Foreign patents and additional patents pending. LIFE RELATED POLICY In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence. Xicor's products are not authorized for use as critical components in life support devices or systems. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its satety or effectiveness.
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